Leaders of the pack: Kraft, Frito Lay top event roster

13-Jan-2014 - Last updated on 13-Jan-2014 at 06:04 GMT

The Packaging Conference 2014 will feature an address by the Kraft Foods packaging team member behind MiO water additives.

The upcoming Packaging Conference 2014 will feature senior executives from top suppliers and consumer packaged goods firms.

Representatives from Frito Lay North America and Kraft Foods are among the industry experts slated to share packaging insights at the upcoming Packaging Conference 2014.

Program content

The event (presented by packaging materials provider Plastic Technologies (PTI) and SBA-CCI) is designed to bring professionals together to share packaging strategies, design ideas and experience in innovation. Additionally, suppliers like BP Amoco will present emerging technologies, such as polyester advancements.

Packaging leaders, and R&D staffers, can face considerable challenges in providing effective packages with limited time and budget. Garry Kohl and David Lestage, PhD, will talk about their experience as senior Frito Lay packaging staff to discuss how to leverage internal resources to bring about packaging success.

Peter Borowski, head of design for Kraft Foods Group (credited with the launch of MiO water additives) will lead a panel discussion “Why Integrating 2D and 3D thinking into the developmental process is needed today.” His session will touch upon the benefits of taking an integrated approach to packaging design, in order to get products to market more quickly, and more efficiently.

Special events

Added to this year’s Packaging Conference agenda: a special session covering the Latin American marketplace. The goal of the program is to provide brand owners and suppliers supporting the market a chance to connect and discuss mutual opportunities.

Another highlight of The Packaging Conference 2014 is a focus on environmental issues. The event will bring to the forefront ways to harness sustainable packaging to help create brand loyalty, find cost-effective solutions and maintain high performance.

The event is scheduled February 3-5 in Orlando. Discounted registration for the event is available until January 15 on the event website, www.thepackagingconference.com.